High-purity oxygen-free copper (pure copper particles), an electroplated copper anode material, the main material is copper, and the typical copper content is over 99.99%. The product is mainly used in the field of HDI board horizontal electroplating copper manufacturing. The pure copper particles are processed by professional vacuum refining technology, the oxygen content is less than 10ppm, and the crystal lattice is fine. It has the advantages of stable electroplating uniformity, no anode film (phosphor copper film), which greatly improves production efficiency and reduces maintenance costs.